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Precision Assembly Technologies for Mini and Micro Products : Proceedings of the IFIP TC5 WG5.5 Third International Precision Assembly Seminar (IPAS'2006), 19-21 February 2006, Bad Hofgastein, Austria / edited by Svetan Ratchev
(IFIP Advances in Information and Communication Technology. ISSN:1868422X ; 198)

データ種別	電子ブック
版	1st ed. 2006.
出版者	(New York, NY : Springer US : Imprint: Springer)
出版年	2006
大きさ	XII, 336 p : online resource
著者標目	Ratchev, Svetan editor SpringerLink (Online service)

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URL	巻　次	配架場所	請求記号	登録番号	コメント	刷　年	状　態	利用注記	ISBN	予約	請求メモ
URL		射水-電子	007	EB0003454	Computer Scinece R0 2005-6,2022-3				9780387312774

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一般注記	Micro Handling and Feeding Techniques -- Design of a Capillary Gripper for a Submillimetric Application -- Multi-Axes Micro Gripper for the Handling and Alignment of Flexible Micro Parts -- Design, Fabrication and Characterization of a Flexible System Based on Thermal Glue for in Air and in SEM Microassembly -- Design and Experimental Evaluation of an Electrostatic Micro-Gripping System -- A Generic Approach for a Micro Parts Feeding System -- Pneumatic Contactless Feeder for Microassembly -- Robotics and Robot Applications for Precision Assembly -- “Parvus” a Micro-Parallel-Scara Robot for Desktop Assembly Lines -- Methods for Comparing Servo Grippers for Mini and Micro Assembly Applications -- Compliant Parallel Robots -- Test Environment for High-Performance Precision Assembly - Development and Preliminary Tests -- Sensor Guided Micro Assembly by Using Laser-Scanning Technology -- High Speed and Low Weight Micro Actuators for High Precision Assembly Applications -- Design and Planning for Microassembly -- Automated Assembly Planning Based on Skeleton Modelling Strategy -- Morphological Classification of Hybrid Microsystems Assembly -- First Steps in Integrating Micro-Assembly Features into Industrially used DFA Software -- Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro-Assembly -- The Importance of Concept and Design Visualisation in the Production of an Automated Assembly and Test Machine -- Development of Passive Alignment Techniques for the Assembly of Hybrid Microsystems -- Modular Assembly Systems and Control Applications -- Miniature Reconfigurable Assembly Line for Small Products -- Conception of a Scalable Production for Micro-Mechatronical Products -- Towards an Integrated Assembly Process Decomposition and Modular Equipment Configuration -- Evolvable Skills for Assembly Systems -- Toward the Vision Based Supervision of Microfactories Through Images Mosaicing -- Precision Multi-Degrees-of-Freedom Positioning Systems -- Economic Aspects of Microassembly -- What is the Best Way to Increase Efficiency in Precision Assembly? -- Life Cycle and Cost Analysis for Modular Re-Configurable Final Assembly Systems -- Impact of Bad Components on Costs and Productivity in Automatic Assembly -- Microassembly — Solutions and Applications -- The Reliable Application of Average and Highly Viscous Media -- Laser Sealed Packaging for Microsystems -- Modelling and Characterisation of an Ortho-Planar Micro-Valve -- Microhandling and Assembly: The Project Assemic International Federation for Information Processing The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing. For more information about the 300 other books in the IFIP series, please visit www.springeronline.com. For more information about IFIP, please visit www.ifip.org HTTP:URL=https://doi.org/10.1007/0-387-31277-3
件　名	LCSH:Electronic circuits LCSH:Industrial engineering LCSH:Production engineering LCSH:Artificial intelligence LCSH:Computer science FREE:Electronic Circuits and Systems FREE:Industrial and Production Engineering FREE:Artificial Intelligence FREE:Computer Science
分　類	LCC:TK7867-7867.5 DC23:621.3815
書誌ID	EB00002842
ISBN	9780387312774