Components, Packaging & Manufacturing Technology Society
著者名典拠詳細を表示
| 著者の属性 | 団体 |
|---|---|
| 一般注記 | Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, c1994: t.p. (The Components, Packaging & Manufacturing Technology (CPMT) Society ... one of the 35+ technical groups within the Institute of Electrical and Electronics Engineers) p. iii (Components, Packaging, and Manufacturing Technology Society of IEEE formerly (CHMT)) IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, Feb. 1994: t.p. (IEEE Components, Packaging, and Manufacturing Technology Society) verso t.p. (Components, Packaging, and Manufacturing Technology Society) IEEE transactions on components, hybrids, and manufacturing technology, Mar. 1978 (a.e.) t.p. (IEEE Components, Hybrids, and Manufacturing Technology Society) verso t.p. (The Components, Hybrids, and Manufacturing Technology Society is an organization within the framework of the IEEE) SRC:IEEE transactions on components, packaging, and manufacturing technology. Part A(Institute of Electrical and Electronics Engineers, 1994-) |
| から見よ参照 | CPMT Components, Packaging, and Manufacturing Technology Society Institute of Electrical and Electronic Engineers. Components, Packaging & Manufacturing Technology Society IEEE Components, Packaging, and Manufacturing Technology Society |
| をも見よ参照 | |
| コード類 | 典拠ID=AU00016430 NCID=DA08354018 |
| 1 | IEEE transactions on components and packaging technologies Vol. 22, no. 1 (Mar. 1999)-. - Piscataway, N.J. : Institute of Electrical and Electronics Engineers , 1999- |
| 2 | IEEE transactions on components, packaging, and manufacturing technology Piscataway, N.J. : Institute of Electrical and Electronics Engineers |